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1 of 12 optimum technology matching? applied gaas hbt ingap hbt gaas mesfet sige bicmos si bicmos sige hbt gaas phemt si cmos si bjt gan hemt functional block diagram rf micro devices?, rfmd?, optimum technology matching?, enabling wireless connectivity?, powerstar?, polaris? total radio? and ultimateblue? are trademarks of rfmd, llc. bluetooth is a trade- mark owned by bluetooth sig, inc., u.s.a. and licensed for use by rfmd. all other trade names, trademarks and registered tradem arks are the property of their respective owners. ?2006, rf micro devices, inc. product description 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . ordering information ctrl1 ctrl2 vdd gnd gnd rf4 gnd rf3 gnd gnd gnd ant rf1 gnd rf2 vbat 1 2 3 4 12 11 10 9 5 6 7 8 16 15 14 13 cmos decoder phemt switch rf1450 sp4t switch the rf1450 is a single-pole four-throw (sp4t) high power switch specially designed to handle gsm power applic ations. excellent linearity perfor- mance achieved by the rf1450 makes it ideal for multimode gsm/edge/w-cdma applications. addi tionally, rf1450 includes inte- grated decoding logic, allowing just two control lines needed for switch control. the rf1450 is packaged in a very compact 3mmx3mmx0.9mm, 16-pin, leadless qfn package. features ? low insertion loss 0.4db @ 1ghz ? high isolation 29db @ 1ghz ? v dd =2.5v to 2.85v, down to 1.8v with reduced specifica- tions ? high linearity imd <-110dbm ? harmonics: -75dbc@1ghz ? gaas phemt process applications ? cellular handset applications ? multi-mode gsm, w-cdma applications ? gsm/gprs/edge switch applications ? cellular infrastructure appli- cations rf1450sp4t switch rf1450 sp4t switch RF1450PCBA-410 fully assembled evaluation board rev a0 ds070531 9 9 rohs compliant & pb-free product package style: qfn, 16-pin, 3mmx3mm
2 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . absolute maximum ratings parameter rating unit v batt 6.0 v v dd 3.0 v maximum input power (0ghz to 2ghz, 2.5v control) +36 dbm operating temperature -20 to +85 c storage temperature -35 to +100 c parameter specification unit condition min. typ. max. electrical characteristics active mode: v high > 1.3v, v low < 0.05v; temp=25c; v dd =2.5v to 2.85v p in =34.5dbm@0.9ghz or 31dbm@1.8ghz; all rf ports terminated to z o =50 . insertion loss 0.5ghz to 1.0ghz 0.40 0.55 db 1.0ghz to 2.0ghz 0.45 0.60 db 2.1ghz 0.50 0.65 db 2.5ghz 0.60 0.90 db isolation 0.5ghz to 1.0ghz 27 29 db 1.0ghz to 2.0ghz 22 24 db 2.1ghz 21 23 db 2.5ghz 19 21 db rf port return loss 0.5ghz to 2.2ghz 15 db all rf ports in insertion loss state. operating characteristics input power at 0.1db compression point 37 dbm f = 0.9 ghz 34 dbm f=1.8ghz second harmonic (2f 0 ) -80 dbc f=0.9ghz, p in =34.5dbm -85 dbc f=1.8ghz, p in =31.5dbm third harmonic (3f 0 ) -80 dbc f=0.9ghz, p in =34.5dbm -80 dbc f=1.8ghz, p in =31.5dbm imd -110 dbm fundamental frequency power level=+20dbm @ 1950mhz blocker power level=-15dbm @ 1760mhz power handling in mismatched condition 34.5 dbm vswr>20; f=0.9ghz 31.0 dbm vswr>20; f=1.8ghz switching speed 5 s start-up time 25 s maximum set up time for the switch to reach fully compliant operation caution! esd sensitive device. the information in this publication is believed to be accurate and reliable. how- ever, no responsibility is assumed by rf micro devices, inc. ("rfmd") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. no license is granted by implication or otherwise under any patent or patent rights of rfmd. rfmd reserves the right to change component cir- cuitry, recommended application circuitry and specifications at any time without prior notice. rohs status based on eudirective2002/95/ec (at time of this document revi- sion).
3 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . parameter specification unit condition min. typ. max. vdd=1.8v<2.5v, temp=25c second harmonic 2f 0 -80 dbc f=0.9ghz, p in =34.5dbm -80 dbc f=1.8ghz, p in =31.5dbm third harmonic 3f 0 -75 dbc f=0.9ghz, p in =34.5dbm -75 dbc f=1.8ghz, p in =31.5dbm imd -105 dbm fundamental frequency power level=+20dbm @ 1950mhz blocker power level=-15dbm @ 1760mhz supply and control signal characteristics supply voltage (v bat )2.9 4.4v supply current (v bat ) standby mode 0.1 a active mode 0.55 1.50 a switched supp ly voltage (v dd ) v high 1.80 2.50 2.85 v with reduced specifications below 2.5v v dd , see electrical parameters table. v low 00.05v switched supply current (v dd ) i high 160 250 a i low 0ma control voltage (ctrl1, ctrl2) v high 1.3 2.7 v v low 00.05v control current (ctrl1, ctrl2) i high 0.5 a i low 0.5 a *through phase is defined as measured no rmalized using a reference calibration pwb.
4 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pin function description 1gnd ground. 2vdd supply. the voltage at this node will be switched and it is important that the switch is operating within the spec- ified start up time. this signal might be used as a mode control. 3ctrl2 control signal 2. 4ctrl1 control signal 1. 5gnd ground. 6rf4 rf output 4. 7gnd ground. 8rf3 rf output 3. 9gnd ground. 10 gnd ground. 11 ant rf input (connected to antenna). 12 gnd ground. 13 rf1 rf output 1. 14 gnd ground. 15 rf2 rf output 2. 16 vbat constant supply. pkg base gnd ground.
5 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pin out package drawing 1 2 3 4 5 6 7 8 12 11 10 9 16 15 14 13 gnd vdd ctrl2 ctrl1 gnd rf4 gnd rf3 gnd ant gnd gnd vbat rf2 gnd rf1 dimensions in mm. shaded lead is pin 1. pin 1 3.000 0.050 0.203 0.013 typ. 0.850 0.050 0.230 0.050 typ 0.375 0.050 typ 1.700 0.150 2 pl 1.500 ref 0.500 typ 3.000 0.050
6 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . general information control logic the switch is operable in four states (see truth table, below). the switch is designed for two modes: active and stand-by. thes e modes are controlled by the v dd signal. when vdd is high, the switch is active. the start-up time is defined as the switch acti- vated is critical. truth table for switch states turn on sequence turn off sequence note: v batt must be applied before applying v dd when turning on the part. the part mu st be turned off in reverse order, v dd first then v batt . electrical test methods the electrical parameters for the switch were measured on te st pwb provided by the switch supplier. the test pwb includes means for decoupling rf signals fr om control signal port (shunt capacitor at control signal ports). all measurements are done with calibration plane at switch pins. the effect of test board losses and phase delay has been removed from the results. reflected harmonics measurement the reflected harmonics should be measured with the output po rts connected to open-circuit or short-circuit impedances. an outline of the measurement set-up is shown in figure 1. the powe r in and reflected signal levels are calibrated to the dut inpu t (reference plane). note that the power is calibrated in a 50 system. the assumption is made that the measurement system is designed so that the harmonic levels of external pa, etc., are far below the signals produced by the dut. state ctrl1 ctrl2 rf path 1v low v low ant-rf1 2v low v high ant-rf2 3v high v low ant-rf3 4v high v high ant-rf4 vbatt vdd ctrl1 ctrl2 rf power 1onoffoffoffoff 2 x on off off off 3xxononoff 4xxxxon vbatt vdd ctrl1 ctrl2 rf power 1ononononoff 2ononoffoffx 3onoffx x x 4offxxxx
7 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . the phase delay for rfout1 is altered between 0 and 360, so that all possible load phases are scanned. the vswr at the connection shall be 20:1@0.9ghz, 15:1@1.8ghz. the other outputs, shall be connected to open-circuit (p in left open) or sig- nal ground; both options should be test ed. after testing rfout1, the same test should be done for the other outputs. directional coupler attenuator rf1 rf2 rf3 rf4 delay line open-circuit or short-circuit reference plane dut measure harmonic signal reflected signal figure 1. reflected harmonics measurement set-up
8 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . application schematic application diagram and guidelines the decoupling capacitors are optional and, if necessary, may be used for noise reduction. decoupling capacitors on the con- trol pins protect the control circuitry from possible rf leakage. an esd filter is needed to protect the switch from antenna es d events. the filter is formed by lesd inductor and cesd capacito r. the switch has a supply input to feed the built-in logic deco d- ing. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 100 pf 10 kpf vdd vbat ctrl2 100 pf ctrl1 100 pf 100 pf cesd= 0.75 pf lesd= 12 uh 100 pf 100 pf rf2 rf1 ant rf3 rf4 100 pf 100 pf
9 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . evaluation board layout board size 2.0? x 2.0? board thickness 0.0658?, board material fr-4 component layer topside rf layer ground plane layer
10 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . typical performance return loss -25.0 -20.0 -15.0 -10.0 -5.0 0.0 400.0 900.0 1400.0 1900.0 2400.0 2900.0 mhz db insertion loss -2.0 -1.0 0.0 400.0 900.0 1400.0 1900.0 2400.0 2900.0 mhz db isolation -50.0 -45.0 -40.0 -35.0 -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 400.0 900.0 1400.0 1900.0 2400.0 2900.0 mhz db
11 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pcb design requirements pcb surface finish the pcb surface finish used for rfmd's qualification process is electroless nickel, immersion gold. typical thickness is 3 inch to 8 inch gold over 180 inch nickel. pcb land pattern recommendation pcb land patterns for rfmd components are based on ipc-735 1 standards and rfmd empirica l data. the pad pattern shown has been developed and tested for optimized assembly at rf md. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. pcb metal land pattern 0.50 typ. pin 16 pin 12 pin 1 pin 8 b b b b a a a a c b b b b a a a a dimensions in mm. a = 0.64 x 0.28 typ. b = 0.28 x 0.64 typ. c = 1.70 sq. 0.50 typ. 0.55 typ. 0.55 typ. 0.75 typ. 0.75 1.50 typ. figure 1. pcb metal land pattern (top view)
12 of 12 rf1450 rev a0 ds070531 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pcb solder mask pattern liquid photo-imageable (lpi) so lder mask is recommended. the solder mask footprint will match what is shown for the pcb metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. the center-grounding pad shall also have a solder mask clearance. expansion of the pads to create solder mask clearance can be provided in the master data or reques ted from the pcb fabrication supplier. thermal pad and via design the pcb land pattern has been designed with a thermal pad th at matches the die paddle size on the bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. the via pattern used for the rfmd qualification is based on th ru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm pl ating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. b b b b a a a a b b b b a a a c a a = 0.74 x 0.38 typ. b = 0.38 x 0.74 typ. c = 1.70 sq. dimensions in mm. pin 16 pin 1 pin 8 pin 12 1.50 typ. 0.50 typ. 0.50 typ. 0.55 typ. 0.55 typ. 0.75 typ. 1.50 typ. 0.75 typ. figure 2. pcb solder mask pattern (top view)

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